Company profile: SemiDice
1.1 - Company Overview
Company description
- Provider of wafer and bare die components and services for the microelectronic industry. Supplies active and passive die/wafer (memory, analog, power management, RF, transistors, diodes, SiC, sensors) and offers wafer processing/probing, lot acceptance testing, die storage; component design/packaging, electrical, reliability and environmental testing, inspection, up-screening; modification (BGA reballing, hot solder dip, lead/CGA attach, trim/form, reconditioning, marking, labeling, kitting); and supplier-managed inventory.
Products and services
- Component Services: Semi Dice architects custom-engineered component design and packaging, conducts electrical, reliability, and environmental testing, and performs inspection plus up-screening for defense, aerospace, medical, and industrial programs
- Die & Wafer Products: Semi Dice delivers industrial-grade active and passive bare die and wafer components—memory, analog, power management, RF, transistors, diodes, SiC, sensors—serving defense, aerospace, medical, industrial markets
- Die & Wafer Services: Semi Dice offers production-scale processing and probing, executes lot acceptance testing, and maintains long-term die storage for defense, aerospace, medical, and industrial microelectronic programs
Key contacts
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Financial details
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1.2 - Competitors and similar companies to SemiDice
Integra Technologies
HQ: United States
Website
- Description: Provider of OSAT and semiconductor production test, testing, qualification, and related technical services for semiconductor manufacturers and fabless semiconductor, aerospace, space, military, medical, automotive, industrial, and commercial OEMs, including a broad array of counterfeit detection services.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Polar Semiconductor
HQ: United States
Website
- Description: Provider of semiconductor manufacturing (prototype development and volume production) and technology development services, focused on high-voltage ICs, discrete components and proprietary silicon technologies such as split-gate MOSFETs for automotive, industrial and consumer markets. Products include power inverters, DC/DC converters, electric compressors, motor control, safety systems, wind and grid conversion, robotics, LED lighting, and home appliances, meeting AEC-Q100/Q200.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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CBL Electronics
HQ: Italy
Website
- Description: Provider of electronics offerings for the defense, aerospace, avionics, and semiconductor markets.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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MagnaLynx
HQ: United States
Website
- Description: Provider of high-speed serial chip-to-chip interfaces that dramatically increase performance while reducing power and pin requirements. Sampling the industry's fastest SRAM device based on the MagnaPHY serial memory protocol. Offers memory products, design services, and IP cores used in the network.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Hardent
HQ: Canada
Website
- Description: Provider of engineering and design services, training solutions, and IP products. Expertise in FPGA/ASIC design and verification, embedded systems, and DSP. Offers controller IP cores for PCIe, CXL, MIPI CSI-2/DSI-2, and high-bandwidth memories (HBM, GDDR, LPDDR) for SoCs, ASICs, and FPGAs in AI/ML, data center, edge, graphics, networking, mobile, automotive, and IoT applications.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
View full Hardent company profile →
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2.M&A buyers
2.1 Potential strategic acquirers in the sector
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2.2 - Strategic buyer groups for SemiDice
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Buyer group 3: ████████ ████████
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3. Investors and private equity firms
3.1 - Buyout funds investing in similar companies to SemiDice
2.2 - Growth funds investing in similar companies to SemiDice
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4 - Top valuation comps for SemiDice
4.2 - Public trading comparable groups for SemiDice
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