Company profile: IceMOS Technology
1.1 - Company Overview
Company description
- Provider of thick-film bonded silicon-on-insulator wafers and engineered substrate solutions, including bonded SOI, Si-Si direct bonded and cavity bonded wafers for IC and MEMS. Offers dielectric isolation technology, wafer interconnect, foundry services for IC and MEMS/MST, and develops high-voltage Superjunction MOSFETs; Si-Si wafers support power devices and PiN diodes.
Products and services
- Thick Film SOI Wafers: IceMOS supplies industrial-grade 100–200mm thick-film bonded silicon-on-insulator wafers for integrated circuits and MEMS applications, offering a wide range of specifications
- SiSi Bonded Wafers: IceMOS delivers device-grade silicon–silicon direct bonded wafers, a cost-effective alternative to thick epitaxial layers for power devices and PiN diodes
- Cavity Bonded SOI Wafers: IceMOS supplies microfabrication-ready 100–150mm cavity bonded SOI wafers for MEMS, featuring pre-etched cavities under a silicon membrane to enable device integration
Key contacts
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Financial details
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1.2 - Competitors and similar companies to IceMOS Technology
Source III
HQ: United States
Website
- Description: Provider of vector translation software.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
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CBL Electronics
HQ: Italy
Website
- Description: Provider of electronics offerings for the defense, aerospace, avionics, and semiconductor markets.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Lundinova
HQ: Sweden
Website
- Description: Provider of engineering design and product development services, offering consulting for IT and telecom companies to develop new models and accessories, and software/hardware solutions for manufacturing and surveillance companies, including control systems and power electronics.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Synapse Design
HQ: United States
Website
- Description: Provider of design services for top-tier Semiconductor and System companies worldwide, serving $1B+ revenue customers as an engineering backbone and enabling them to address technical and resource challenges to build next-generation products.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Ansen
HQ: United States
Website
- Description: Provider of contract electronic manufacturing services in North America and China, with over 36 years of EMS expertise; ISO 9001 and ISO 13485 certified and FDA-registered for Class III medical devices.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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2.M&A buyers
2.1 Potential strategic acquirers in the sector
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2.2 - Strategic buyer groups for IceMOS Technology
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Buyer group 3: ████████ ████████
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3. Investors and private equity firms
3.1 - Buyout funds investing in similar companies to IceMOS Technology
2.2 - Growth funds investing in similar companies to IceMOS Technology
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4 - Top valuation comps for IceMOS Technology
4.2 - Public trading comparable groups for IceMOS Technology
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