Company profile: Besi
1.1 - Company Overview
Company description
- Provider of semiconductor assembly equipment worldwide for the semiconductor and electronics industries, offering die attach and die sorting systems; flip chip assembly; thermo compression bonding; packaging molding; trim, form and singulation equipment; and plating and cleaning systems for leadframes, connectors, solar cells, and films.
Products and services
- Die Attach Equipment: Industrial-grade machines that attach semiconductor dies to substrates or leadframes, handling single chips, multi chips, multi modules, flip chips, TCB and eWLB die bonding, plus die sorting
- Thermo Compression Bonding Systems: High-precision systems that bond semiconductor components using heat and pressure, supporting TCB die bonding for semiconductor and electronics industries worldwide
- Flip Chip Equipment: Precision-grade systems for flip chip assembly, placing and bonding chips face-down on substrates for semiconductor and electronics manufacturing worldwide
Key contacts
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Financial details
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1.2 - Competitors and similar companies to Besi
Riber
HQ: France
Website
- Description: Provider of molecular beam epitaxy (MBE) equipment, enabling precise deposition of materials onto substrates for designing and creating advanced semiconductor structures and novel devices; also a leading supplier of high-quality material evaporation sources.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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FormFactor
HQ: United States
Website
- Description: Provider of advanced wafer probe cards and MEMS probes; probe systems for IC validation from lab to fab, including quantum cryogenic and thermal management tools; RF/mmW probing up to 300 GHz for 5G, 6G, WiFi/WiGig, and automotive radar; integrated on-wafer mm-wave load-pull; terahertz probing for materials and semiconductor research; and silicon photonics wafer probing for LiDAR.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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MCT International
HQ: United States
Website
- Description: Provider of integrated circuit handling equipment for the semiconductor industry, offering manufacturing, marketing, distribution, and support.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
View full MCT International company profile →
F&K Delvotec
HQ: Germany
Website
- Description: Provider of wire, laser, and ultrasonic bonding solutions, offering semi- and fully automated wire bonders (M17 series) for semiconductor, e-mobility, photovoltaics, and automotive. Supplies laser welding systems (DelvoLAZ, MegaLAZ, GigaLAZ) for cell-to-module/pack/chassis, and laserbonding of thick aluminum/copper ribbons on DCB substrates and copper terminals for power electronics, plus ultrasonic bonding for MEMS and sensors.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
View full F&K Delvotec company profile →
Kinetics
HQ: United States
Website
- Description: Provider of full-service process and mechanical contracting for high-technology markets, specializing in design and installation of process, mechanical, plumbing, and HVAC systems. Offers integrated plant construction, facility management, maintenance of chemical and gas systems, CDA compressors and dryers, no-touch AR HMI, fume hoods, and legacy equipment refurbishment and support.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
View full Kinetics company profile →
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2.M&A buyers
2.1 Potential strategic acquirers in the sector
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2.2 - Strategic buyer groups for Besi
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Buyer group 2: ████████ ████████
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Buyer group 3: ████████ ████████
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3. Investors and private equity firms
3.1 - Buyout funds investing in similar companies to Besi
2.2 - Growth funds investing in similar companies to Besi
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4 - Top valuation comps for Besi
4.2 - Public trading comparable groups for Besi
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