Company profile: FEDD
1.1 - Company Overview
Company description
- Provider of manufactured boards and electronic products for the railway, defence, and industrial sectors.
Products and services
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Key contacts
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Financial details
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1.2 - Competitors and similar companies to FEDD
IC'Alps
HQ: France
Website
- Description: Provider of turnkey ASIC and SoC development and supply, delivering end-to-end services from concept, architecture specification and circuit design to industrialization and scaled production. Offers custom IC design services, feasibility studies for ASIC integration, and advanced ASIC/SoC development. Provides NuRAM, a memory subsystem smaller than SRAM that reduces power consumption via low-leakage power.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
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Widcomm
HQ: United States
Website
- Description: Provider of Bluetooth software, systems, and designs enabling short-range wireless communication among intelligent devices, from computers and cell phones to keyboards and headphones; first to bring certified Bluetooth software and now a market leader in supplying Bluetooth software.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Akeana
HQ: United States
Website
- Description: Provider of semiconductor manufacturing services.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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Moortec
HQ: United Kingdom
Website
- Description: Provider of embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, including a complete PVT Subsystem with a sophisticated PVT-Controller and AMBA APB interfacing, targeting advanced node CMOS technologies from 40nm down to 7nm to support increased device reliability and enhanced performance.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
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IceMOS Technology
HQ: United Kingdom
Website
- Description: Provider of thick-film bonded silicon-on-insulator wafers and engineered substrate solutions, including bonded SOI, Si-Si direct bonded and cavity bonded wafers for IC and MEMS. Offers dielectric isolation technology, wafer interconnect, foundry services for IC and MEMS/MST, and develops high-voltage Superjunction MOSFETs; Si-Si wafers support power devices and PiN diodes.
- Rationale: This competitor operates in a highly similar market segment with overlapping features.
- Company type: Private company
- Employees: ●●●●●
- Total funding raised: $●●●m
- Backers: ●●●●●●●●●●
- Acquisitions: ●●
View full IceMOS Technology company profile →
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2.M&A buyers
2.1 Potential strategic acquirers in the sector
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2.2 - Strategic buyer groups for FEDD
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Buyer group 1: ████████ ████████
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Key Products: ████████, ████████, ████████, ████████
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Buyer group 2: ████████ ████████
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Description: ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████
Key Products: ████████, ████████, ████████, ████████
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Buyer group 3: ████████ ████████
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Description: ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████ ████████
Key Products: ████████, ████████, ████████, ████████
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3. Investors and private equity firms
3.1 - Buyout funds investing in similar companies to FEDD
2.2 - Growth funds investing in similar companies to FEDD
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4 - Top valuation comps for FEDD
4.2 - Public trading comparable groups for FEDD
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